Specializing in Cost Effective Development of PC-based and Embedded High Precision Measurement and Control Systems

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Centerbrook, CT 06409 USA

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3D Submicron Form and Thickness Measurement System using dual white light confocal sensors and precision translation stage system- This instrument was developed for one of the US national laboratories which had a requirement to measure the thickness and flatness of a number of different materials up to three mm thick, each to better than one micron. With careful attention to mechanical design, selection of component materials, and specialized algorithms to compensate for translation stage flatness errors, performance goals were achieved, with both thickness and flatness errors typically much better than 500 nm, even under typical laboratory conditions without specialized temperature control.

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